OVERVIEW

Since its inception, Seksun has continued to invest in technology and processes to provide our customers the best-in-class turnkey solution.

We engage our customers from the early stage of design conceptualization to the delivery of the finished products.

We are a regional leader in Precision Metal Stamping, with vertically integrated operations in Plating, Form-In-Place-Gasket (FIPG), Cleanroom and Mechanical Assembly. We place strong emphasis in supplying High Quality Products to our customers. It is in this mindset that we embrace Six Sigma and proliferate its tools throughout our organization. Personnel were trained with sophisticated real-time SPC monitoring in our Production shopfloors and Chemical Laboratory was also set-up to compliment our manufacturing processes.

We are offering our customers from an Electronics Manufacturing Services (EMS) perspective, a turnkey, box-built and modules assemblies with tests capabilities. Our machines can process 0201 Chip size components with QFP < 12 mils pitch. These contract manufacturing services were invested and available from our Malaysia and China Plants.